2-layer ENIG Power PCB

A 2-layer ENIG power supply printed circuit board is a high-performance PCB designed specifically for power management and signal transmission. Its double-sided circuit layout and electroless nickel immersion gold (ENIG) surface finish guarantee excellent electrical conductivity and durability, making it suitable for various high-frequency and high-power applications.

Product Features

1. Double-sided design: Adopts a 2-layer structure, facilitating complex circuit connections and enhancing design flexibility and compactness.

2. ENIG surface finish: Utilizes electroless nickel immersion gold (ENIG) technology to deliver superior conductivity and wear resistance, ideal for high-frequency signal transmission and reducing contact resistance.

3. Excellent electrical performance: Optimized design ensures signal integrity, suitable for applications with high demands on power and signal quality.

4. Superior heat dissipation: Well-suited for high-power applications, effectively lowering board temperature and improving system stability and reliability.

5. Durability: Manufactured with high-quality materials, featuring strong corrosion and oxidation resistance for use in various environmental conditions.

   
   

Applications

• Power management: Suitable for switching power supplies, DC-DC converters, and other power management systems.

• Industrial equipment: Widely used in industrial control, automation equipment, and related fields.

• Communication equipment: Ideal for base stations, communication modules, and other high-frequency communication devices.

• Consumer electronics: Provides stable power support in high-performance consumer electronic products.

Technical Specifications

• Layers: 2 layers

• Copper thickness: 1 oz

• Base material: FR-4 KB6160

• Solder mask: Green solder mask with white silkscreen

• Minimum hole size: 0.2 mm

• Minimum trace width: 0.1 mm

• Surface finish: Electroless Nickel Immersion Gold (ENIG)

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Production Process

1. Design phase: Circuit design and layout using professional PCB design software.

2. Material selection: Choosing appropriate base materials and copper thickness according to customer requirements.

3. Manufacturing phase: Performing photolithography, etching, drilling, lamination, and other processes.

4. Surface treatment: Applying ENIG surface finishing to ensure excellent conductivity and durability.

5. Testing phase: Conducting electrical and reliability tests to guarantee product quality.

6. Delivery phase: Packaging and shipping upon completion to ensure safe arrival to customers.

Conclusion