Views: 0 Author: Site Editor Publish Time: 2025-12-12 Origin: Site
bright red solder mask ink, paired with 30U gold plating and gold finger surface treatment, this FPGA PCB exudes unrivaled premium quality at first glance. Yet what truly sets it apart isn’t just its striking appearance—it’s the sophisticated design and precision manufacturing that lie beneath.
Let’s start with its multi-layer structure, a core challenge we overcame. Conventional multi-layer PCBs use non-flowable PP for step lamination, but this product demands top-tier high-speed performance. We therefore adopted Panasonic’s M6 series high-speed PCB substrate—yet no matching non-flowable PP exists for M6 on the market. We solved this by using flowable PP for lamination, mastering the tricky step-section fabrication that this approach entails.
It’s also an 18-layer mechanical blind-hole board. To ensure precision, we manufactured the main board as two sub-boards (L1-4 and L5-18) before integrating them via three lamination processes. Multi-layer lamination is already demanding; with special materials like M6, even minor deviations would render the entire board useless—testament to our strict precision control.
For uncompromised high-speed signal transmission, we integrated back-drilling technology to reduce attenuation, avoid distortion, and ensure stable signals: CKT-1 drills from top to bottom (depth: 1.25+1-0.05); CKB-1 drills from bottom to top (0.35mm hole: 1.45±0.05mm depth; 0.351mm hole: 1.25+1-0.05mm; 0.352mm hole: 1.05±0.05mm; 0.353mm hole: 0.2+1-0.05mm).
Need a custom FPGA PCB tailored to your high-performance needs? Contact us and start your order today!
