Meet the 6-Layer PCB That’s Revolutionizing 5G Signal Performance

Tired of 5G signal lag in base stations, industrial gear, or smart vehicles? Our new 6-layer 5G receiver PCB fixes that—with material smarts and precision design built for high-frequency chaos.

We mixed Rogers RO4003C (a top-tier high-frequency laminate) with FR-4 for a win-win: RO4003C cuts phase distortion (its 0.0037 loss factor at 10GHz keeps signals sharp), while FR-4 (tuned for thermal expansion) keeps the board stable from -55℃ to 125℃. Add Sun Ink’s PSR-4000 PF9L solder mask: it’s halogen-free (RoHS 2.0 compliant), handles 0.08mm/0.13mm fine wiring, and boosts oxidation resistance by 40% (168-hour salt spray tested).

Specs that deliver: 6-layer hybrid stack, 1.0mm thickness, 1oz copper (inner/outer), 0.6mm drill holes, and OSP surface treatment. We build it with SHPCB’s HDI system—LDI positioning (±5μm accuracy), 92%+ copper uniformity, and 20μm blind/buried via alignment—so it works for 5G AAU/RRU units, car gateways, and industrial edge nodes.

Need this 5G-ready PCB for your project? Head to our Products page or reach out via Contacts—we’ll customize it to your needs.