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10-Layer 4-Step HDI PCB

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  • 26 2026-02
    10-Layer 4-Step HDI PCB: Powering 5G, AI, and High-Bandwidth Applications
    For consumer electronics and next-gen devices demanding ultra-fast data transfer, our 10-layer 4-step HDI PCB delivers unmatched performance. Built with FR-4 substrate, 1.4mm thickness, and 0.1mm fine routing, it features 50µm laser-drilled microvias and ENIG surface finish, enabling 40Gbps+ signal
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