Views: 0 Author: Site Editor Publish Time: 2026-03-02 Origin: Site
For 5G infrastructure that demands uncompromising performance, our 12-layer 5G communication PCB delivers. Built with FR-4 + SY1000-2 substrate, 2.0mm thickness, and 0.075mm precision routing, it features an immersion gold + electroless gold finish to ensure stable high-frequency signal transmission.
Its multi-layer design supports HDI routing and optimized thermal management, enabling reliable performance in high-power environments. Ideal for 5G base stations, wireless antenna systems, network routers, and IoT gateways, it meets the strict signal integrity and EMI requirements of 5G deployments.
Ready to upgrade your 5G hardware? Contact us today to request a custom quote or technical datasheet.
