Views: 0 Author: Site Editor Publish Time: 2026-03-18 Origin: Site
Elevate mobile device performance with our 8-layer HDI communication PCB, engineered exclusively for high-end smartphones and mobile communication modules. Crafted with S1000-2M substrate, 1.03mm thickness, and 0.5OZ/1OZ copper, it features 0.075mm fine routing, 0.1mm minimum aperture, and 2U’’ immersion gold finish for unrivaled signal integrity.
Integrating first-order HDI, countersunk holes, and 0.2mm BGA capacity, this PCB supports ultra-dense component placement and high-speed 5G signal transmission—ideal for smartphone RF frontends, baseband processors, and wireless charging modules. It delivers the reliability and miniaturization modern mobile devices demand.
Ready to power your flagship mobile design? Contact our team today to request a custom quote or full technical datasheet.
