Views: 0 Author: Site Editor Publish Time: 2026-03-02 Origin: Site
We're thrilled to launch our 6-Layer 5G Communication Terminal PCB—engineered to power high-speed, stable 5G signal transmission for next-gen devices.
Crafted with premium FR-4 substrate and advanced manufacturing processes, this PCB stands out with its ultra-fine routing: 0.08mm line width and 0.13mm line spacing, paired with a 0.6mm minimum hole size, enabling high-density wiring that minimizes signal interference and boosts transmission efficiency. Its 1oz copper thickness and 1.0mm board thickness ensure both high-speed signal performance and excellent heat dissipation, even under heavy loads. The blue solder mask with white legend and OSP surface finish further enhance electrical insulation and oxidation resistance, extending product lifespan.
Ideal for 5G base stations, terminal devices, industrial automation modules, and intelligent transportation systems, this PCB seamlessly integrates with existing communication setups.
Curious to learn more? Head to our Products page. For orders, reach out via our Contacts section today!
