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2-layer ENIG power circuit board is a high-performance printed circuit board professionally designed for power management and signal transmission. Its double-sided circuit layout and electroless nickel immersion gold (ENIG) surface treatment ensure excellent conductivity and durability, making it suitable for a wide range of high-frequency and high-power applications.
Double-sided Design: Adopts a 2-layer structure to facilitate complex circuit connections and enhance design flexibility and compactness.
ENIG Surface Finish: Features electroless nickel immersion gold (ENIG) technology to deliver outstanding conductivity and wear resistance, reduce contact resistance, and support high-frequency signal transmission.
Excellent Electrical Performance: Optimized design guarantees stable signal integrity, perfectly matching applications with high requirements for power supply and signal quality.
Superior Heat Dissipation: Ideal for high-power scenarios, effectively lowering board temperature and improving overall system stability and reliability.
Long Service Life: Manufactured with high-quality raw materials, it offers great corrosion resistance and oxidation resistance to adapt to diverse working environments.
Power Management: Suitable for switching power supplies, DC-DC converters and other power management systems.
Industrial Equipment: Widely applied in industrial control, automation equipment and other industrial sectors.
Communication Equipment: Perfect for high-frequency communication devices such as base stations and communication modules.
Consumer Electronics: Provides stable power supply support for high-performance consumer electronic products.
Layer Count: 2 Layers
Copper Thickness: 1 oz
Base Material: FR-4 KB6160
Solder Mask: Green Solder Mask with White Legend
Minimum Hole Size: 0.2 mm
Minimum Line Width: 0.1 mm
Surface Treatment: ENIG (Electroless Nickel Immersion Gold)
Design Phase: Complete circuit design and layout with professional PCB design software.
Material Selection: Select qualified base material and copper thickness according to customized customer requirements.
Manufacturing Phase: Implement core processes including photolithography, etching, drilling and lamination.
Surface Treatment: Apply ENIG finishing to maintain stable conductivity and long-term durability.
Testing Phase: Conduct comprehensive electrical testing and reliability inspection to ensure qualified product quality.
Delivery Phase: Conduct standardized packaging and shipping to ensure safe product delivery.
The 2-layer ENIG power circuit board is an ideal high-performance power solution for various high-power and high-frequency applications. With superior electrical performance, efficient heat dissipation and durable construction, it fully meets the strict power supply standards of modern electronic equipment.
