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The 4-layer HASL module power circuit board is a high-performance printed circuit board specifically designed for power management and modular applications. Its four-layer structure delivers superior electrical performance and signal integrity, while the HASL surface finish ensures excellent solderability, making it suitable for a wide range of high-power and high-frequency applications.
Product Features
1. Four-layer design: Utilizing a 4-layer structure enables complex circuit layouts, delivering superior signal integrity and electrical performance.
2. Tin Plating Surface Treatment: Utilizing the HASL (Hot Air Solder Leveling) process, it offers excellent solderability, compatibility with various soldering techniques, and ensures reliable connections.
3. Excellent electrical performance: Design optimization ensures signal integrity, making it suitable for applications with high requirements on power and signal quality.
4. Superior heat dissipation performance: Suitable for high-power applications, effectively reducing circuit board temperatures and enhancing system stability and reliability.
5. Durability: Made from high-quality materials with excellent corrosion resistance and oxidation resistance, suitable for various environmental conditions.
application field
Power Management: Suitable for power supply systems such as switching power supplies and DC-DC converters.
Industrial Equipment: Widely used in industrial control, automation devices, and other fields.
Communication Equipment: Suitable for high-frequency communication devices such as base stations and communication modules.
Consumer Electronics: Provides stable power supply support in high-performance consumer electronic products.
Technical Specifications
• Number of floors: 4
Copper thickness: 1 oz for both inner and outer layers
• Board: FR-4 KB6160
Solder mask color: Green oil with white characters
Minimum aperture: 0.2 mm
Minimum trace width: 0.1 mm
Surface treatment: Hot Air Solder Leveling (HASL)
production process
1. Design Phase: Utilize professional PCB design software for circuit design and layout.
2. Material Selection: Choose the appropriate substrate and copper thickness based on customer requirements.
3. Manufacturing phase: Perform processes such as lithography, etching, drilling, and lamination.
4. Surface Treatment: The surface is treated with a tin plating process to ensure excellent solderability and conductivity.
5. Testing phase: Conduct electrical and reliability tests to ensure product quality.
6. Delivery Phase: After completion, the product is packaged and shipped to ensure safe delivery to the customer.
conclusion
The 4-layer tin-plated module power circuit board is an ideal choice for high-performance power solutions, suitable for various high-power and high-frequency applications. With its superior electrical performance, soldering capability, and durability, it can meet the stringent requirements of modern electronic devices for power supply.
