Double-sided immersion gold thick copper power PCB

Double-sided gold-plated thick copper power PCB is a high-performance printed circuit board specially designed for high-power and high-frequency applications. Its double-sided circuit design and electroless nickel immersion gold (ENIG) surface treatment deliver excellent electrical conductivity and durability, making it ideal for applications with strict requirements on power management and signal integrity.

Product Features

1. Double-sided Design: Adopts a double-sided circuit layout to realize complex circuit connections and improve design flexibility.

2. Thick Copper Layer: Copper thickness is generally 2 oz (approximately 70 μm) or higher, which can withstand high current and suit high-power applications.

3. ENIG Surface Treatment: The immersion gold process ensures superior conductivity and wear resistance, supports high-frequency signal transmission, and reduces contact resistance.

4. Excellent Heat Dissipation: The thick copper structure accelerates heat dissipation, lowers board operating temperature, and enhances overall system stability.

5. High Durability: Made of high-quality raw materials with great corrosion resistance and oxidation resistance, adapting to diverse working environments.

Application Fields

• Power Management: Suitable for switching power supplies, DC-DC converters and other power management systems.

• Industrial Equipment: Widely used in industrial control, automation equipment and other industrial scenarios.

• Communication Devices: Applicable to high-frequency communication equipment such as base stations and communication modules.

• Consumer Electronics: Provides stable power supply for high-performance consumer electronic products.

Technical Specifications

• Layer Count: 2 Layers

• Copper Thickness: 2 oz

• Base Material: FR-4 KB6160

• Solder Mask: Green solder mask with white legend

• Minimum Hole Size: 0.2 mm

• Minimum Line Width: 0.1 mm

• Surface Finish: ENIG (Electroless Nickel Immersion Gold)

Production Process

1. Design Phase: Complete circuit design and layout with professional PCB design software.

2. Material Selection: Select qualified base material and copper thickness according to customer requirements.

3. Manufacturing Phase: Complete processes including photolithography, etching, drilling and lamination.

4. Surface Treatment: Apply ENIG finishing to guarantee stable conductivity and long-term durability.

5. Testing Phase: Conduct electrical performance testing and reliability inspection to ensure premium quality.

6. Delivery Phase: Carry out standardized packaging and shipping to ensure safe delivery to customers.

Conclusion

Double-sided ENIG thick copper power PCB is an ideal solution for high-performance power systems and various high-power, high-frequency scenarios. With outstanding electrical performance, efficient heat dissipation and reliable durability, it fully meets the stringent power supply demands of modern electronic equipment.