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Product Overview
The 10 layer 4th stage HDI signal transmission dedicated PCB (three board) is designed for large-scale data processing and high-speed transmission. Compared to the previous five piece board, this product adopts a more lightweight design, which facilitates packaging and disassembly during use. This PCB board adopts a complex 4th order HDI process, which can meet the requirements of high-density interconnection and high-speed signal transmission, and is suitable for various high-performance electronic devices.
Product Features
1. High density wiring: Using 4th stage HDI technology, the wiring density is high, which can achieve more functional integration in limited space.
2. Excellent signal integrity: The 10 layers design ensures the stability and integrity of signal transmission, reducing signal interference and transmission loss.
3. Good thermal stability: FR-4 substrate and gold-plated surface treatment ensure stability and reliability in high temperature environments.
4. Excellent mechanical strength: The black solder mask and white silkscreen design enhances the mechanical strength and corrosion resistance of the board.
5. Environmental sustainability: Adopting environmentally friendly materials and processes that comply with international environmental standards.
Technical specifications and parameters
number of layers | 10 |
substrate | FR-4 |
thickness | 1.45mm |
color | Black solder mask and white silkscreen |
surface treatment | gold immersion |
size | 106.40mm * 178.33mm |
Outer copper thickness | 1μm |
Inner copper thickness | 0.5μm |
Minimum line width/line spacing | 3/3mil |
Application field
High speed communication equipment: suitable for high-speed communication equipment such as 5G base stations and data centers, ensuring high-speed transmission and stability of signals.
High performance computing devices: suitable for AI servers, high-performance computing clusters, etc., to meet the needs of high-density interconnection and large-scale data processing.
Automotive electronics: applicable to auto drive system, vehicle mounted radar, etc., providing high-density wiring and reliable signal transmission.
Medical equipment: suitable for high-end medical imaging equipment, vital sign monitoring equipment, etc., ensuring high performance and stability of the equipment.
Special production process
1. 4th stage HDI process: Through multiple pressing and laser drilling, high-density interconnection is achieved, improving wiring density and circuit complexity.
2. Laser drilling technology: Using laser drilling technology, the aperture is smaller, the wiring space is more saved, and it meets the needs of the market for lightweight and short electronic products.
3. Immersion gold surface treatment: Provides low contact resistance and good soldering performance, protecting the PCB surface from oxidation and corrosion.
4. Black solder mask and white silkscreen: enhances the mechanical strength and corrosion resistance of the board, improves product reliability and aesthetics.
Product Summary
The 10 layer 4th stage HDI signal transmission dedicated PCB (three board) is a high-performance, high-density circuit board designed specifically for high-speed signal transmission and large-scale data processing. Its advanced 4-stage HDI process and gold deposition surface treatment ensure excellent signal integrity and connection reliability. Suitable for fields such as data centers, communication equipment, medical electronics, and aerospace, it is an ideal choice for modern electronic devices.
