loading
| Availability: | |
|---|---|
| Quantity: | |
Product Overview
The 8-layer 2nd stage HDI audio server transmission dedicated PCB is designed specifically for audio data processing and high-speed transmission. This product adopts advanced 2nd order HDI technology, which can achieve high-density wiring in limited space, ensuring high-quality transmission and low distortion of audio signals. The high glass transition temperature of FR-4 substrate and TG-170 ensures the stability and reliability of PCB in high-temperature environments. The black solder mask and white silkscreen design and OSP surface treatment further enhance the mechanical strength and corrosion resistance of the product.
Product Features
1. High density wiring: 2nd stage HDI technology achieves higher wiring density, suitable for high-density audio processing and transmission.
2. Excellent signal integrity: 8-layer design ensures high-quality transmission of audio signals, reducing signal distortion and interference.
3. Good thermal stability: The high glass transition temperature of FR-4 substrate and TG-170 ensures stability and reliability in high-temperature environments.
4. Excellent mechanical strength: The black solder mask and white silkscreen design enhances the mechanical strength and corrosion resistance of the board.
Environmental sustainability: Adopting environmentally friendly materials and processes that comply with international environmental standards.
Technical specifications and parameters
number of layers | 8 |
substrate | FR-4，TG-170 |
thickness | 1.6mm |
solder mask | Black oil white letters |
surface treatment | OSP |
line width and spacing | 0.1mm/0.1mm |
Minimum aperture | 0.2mm |
Outer copper thickness | 1μm |
Inner copper thickness | 0.5μm |
Application field
Professional audio equipment: suitable for professional audio processing equipment such as recording studios, radio stations, theaters, etc., to ensure high-quality audio signal transmission.
Audio Server: Suitable for audio servers, audio workstations, etc., to meet the requirements of high-density audio data processing and transmission.
High end audio system: suitable for high-end home theaters, professional audio systems, etc., providing low distortion and high fidelity audio transmission.
Multimedia equipment: suitable for multimedia players, smart speakers, etc., ensuring the stability and high quality of audio signals.
Special production process
1.2th-stage HDI process: Through multiple pressing and laser drilling, high-density interconnection is achieved, improving wiring density and circuit complexity.
2. Laser drilling technology: Using laser drilling technology, the aperture is smaller, the wiring space is more saved, and it meets the needs of the market for lightweight and short electronic products.
3. OSP surface treatment: Provides good soldering performance, protects the PCB surface from oxidation and corrosion, and ensures soldering quality.
4. Black solder mask and white silkscreen: enhances the mechanical strength and corrosion resistance of the board, improves product reliability and aesthetics.
Product Summary
The 8-layer 2nd stage HDI audio transmission server dedicated PCB is a high-performance, high-density PCB board designed specifically for audio data processing and high-speed transmission. Its high-density wiring, excellent signal integrity, good thermal stability, and outstanding mechanical strength make it widely applicable in fields such as professional audio equipment, audio servers, high-end audio systems, and multimedia devices. Adopting advanced 2nd stage HDI technology and OSP surface treatment to ensure high performance and reliability of the product, it is an ideal choice for modern audio equipment.
