6-Layer 1-Stage HDI PCB with Immersion Gold

Product Overview

6-layer 1st stage HDI gold-plated PCB is a printed circuit board designed specifically for complex operating systems in high-performance electronic devices. It adopts advanced HDI technology, combined with gold deposition surface treatment process, to ensure excellent electrical performance and reliability. This product is widely used in electronic devices that require high-density wiring and high-performance transmission, such as smartphones, high-performance computers, communication devices, etc

Product Features

1. High density wiring: Using first-order HDI technology to achieve smaller line widths and spacing, improving wiring density. 2 Meet the integration requirements of complex electronic devices.

2. Excellent electrical performance: The gold-plated surface treatment process provides good conductivity and oxidation resistance, ensuring the stability and reliability of signal transmission

3. High reliability: FR-4 substrate has excellent mechanical strength and heat resistance, and can work stably for a long time in harsh environments

4. Fine solder mask process: The green solder mask and white silkscreen layer not only looks beautiful, but also effectively protects the PCB surface, preventing short circuits and corrosion

5. Accurate back drilling process: using depth control drilling technology to ensure the depth and accuracy of the back drilling, meeting complex wiring and connection requirements

Technical specifications and parameters

Application field

Smartphone: A motherboard used for high-performance smartphones that supports complex communication and data processing functions

High performance computer: suitable for servers and high-performance computing devices, providing high-speed data transmission and processing capabilities

Communication equipment: such as routers, switches, etc., to meet the needs of high-speed communication and network connectivity

Medical equipment: used for the control and data processing of precision medical instruments, ensuring the stability and reliability of the equipment

Special production process

1. HDI technology: high-density interconnect technology, achieving smaller line widths and spacing, and improving wiring density

2. Gold deposition process: By electrochemical deposition, a uniform gold layer is formed on the surface of the PCB, providing excellent conductivity and oxidation resistance

3. Control depth drilling technology: Accurately control the depth and accuracy of the back drilling hole to meet complex wiring and connection requirements

4. Green solder mask and white silkscreen process: High quality green oil and white letter ink are used to ensure the beauty and functionality of the solder mask layer

Product Summary

6-layer 1st stage HDI gold-plated PCB is an ideal choice for high-performance electronic devices due to its high-density wiring, excellent electrical performance, high reliability, and fine craftsmanship. It can not only meet the integration requirements of complex electronic devices, but also work stably in harsh environments for a long time, providing a solid foundation for the performance improvement and reliability guarantee of electronic products.