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Product Overview
The 12 layers HDI electronic server dedicated PCB is a printed circuit board designed for complex operating systems of high-performance electronic server equipment. It adopts advanced HDI (high-density interconnect) technology, combined with various surface treatment processes, to ensure excellent electrical performance and reliability. This product is widely used in electronic servers that require high-density cabling and high-performance transmission, such as data center servers, high-performance computing servers, etc
Product Features
1. Ultra high wiring density: Using multi-layer HDI technology to achieve smaller line widths and spacing, improve wiring density, and meet the integration requirements of complex electronic servers
2. Excellent electrical performance: The immersion gold and OSP surface treatment process provides good conductivity and oxidation resistance, ensuring the stability and reliability of signal transmission
3. High heat resistance: FR-4 TG-170 substrate has excellent heat resistance and can work stably for a long time in high temperature environments
4. Fine solder mask process: The black solder mask and white silkscreen layer not only looks beautiful, but also effectively protects the PCB surface, preventing short circuits and corrosion
5. High reliability: The 12 layers structural design enhances the mechanical strength and stability of the PCB, ensuring reliability in complex working environments
Technical specifications and parameters
number of layers | 12 |
raw materials | FR-4 TG-170 |
thickness | 1.2mm |
copper thickness | 1 ounce (customizable according to demand) |
color | black solder mask and white silkscreen |
Minimum line width/line spacing | 3mil/3mil |
Is there a solder mask present | yes |
Surface treatment method | Sinking gold OSP |
Is there a solder mask present
Surface treatment method: immersion gold OSP
Application field
Data Center Server: A motherboard used for high-performance data center servers, supporting complex computing and data processing functions
High performance computing server: suitable for high-performance computing servers, providing high-speed data transmission and processing capabilities
Network communication equipment: such as high-performance routers, switches, etc., to meet the needs of high-speed communication and network connectivity
Industrial automation control equipment: used for the control and data processing of precision industrial automation control equipment, ensuring the stability and reliability of the equipment
Special production process
1. Multilayer HDI technology: Achieve smaller line widths and spacing, improve wiring density, and meet the integration requirements of complex electronic servers
2. Gold deposition and OSP process: The gold deposition process forms a uniform layer of gold on the surface of the PCB through electrochemical deposition, providing excellent conductivity and oxidation resistance; The OSP process forms an organic protective layer on the surface of the PCB to prevent copper oxidation
3. Black solder mask and white silkscreen process: High quality black oil and white lettering ink are used to ensure the beauty and functionality of the solder mask layer
4. High precision drilling technology: ensures the drilling accuracy and hole wall quality of multi-layer PCBs, meeting complex wiring and connection requirements
Product Summary
The 12 layer HDI electronic server dedicated PCB is an ideal choice for high-performance electronic servers due to its ultra-high wiring density, excellent electrical performance, high heat resistance, and high reliability. It can not only meet the integration requirements of complex electronic servers, but also work stably in high temperature environments for a long time, providing a solid foundation for the performance improvement and reliability guarantee of electronic servers.