loading
The iron-core high-frequency PCB is a printed circuit board specifically designed for high-frequency applications, widely used in fields such as communications, radar, satellites, and medical equipment. This product boasts excellent electrical performance and thermal stability, meeting the needs of high-frequency signal transmission.
Product Features
1. High-frequency performance
2. The design supports high-frequency signal transmission, with a frequency range reaching up to tens of GHz, making it suitable for high-frequency applications such as 5G and Wi-Fi 6.
3. High-quality substrate
4. Utilize materials with low dielectric constant and low loss (such as PTFE, ceramic substrates, etc.) to effectively reduce signal attenuation and reflection.
5. Iron-melting furnace process
6. The iron-core furnace welding process is adopted to ensure that the welding points are firm and suitable for long-term use in high-temperature environments.
7. Excellent thermal stability
8. The design takes thermal management into consideration, ensuring stable performance even under high-power operation conditions.
9. Precision manufacturing
10. Advanced manufacturing technology is adopted to ensure high precision of the circuit, making it suitable for complex circuit design.
Application areas
Wireless communication equipment
Used for base stations, routers, wireless transmission modules, etc.
Radar and satellite communication
Applied to high-frequency applications such as radar systems and satellite communication equipment.
medical equipment
Suitable for high-frequency medical imaging equipment, monitoring instruments, etc.
Automotive Electronics
Used in vehicle communication systems, autonomous driving sensors, etc.
Technical Specifications
Number of layers: 2
Sheet thickness: 0.6mm
Sheet material: Teflon (polytetrafluoroethylene)
Minimum aperture: 0.8mm
Minimum line width/line spacing: 0.12mm
Outer copper thickness: 1OZ
Surface treatment: immersion gold plating
Design and manufacturing process
1. Requirement analysis
2. Communicate with customers to understand product requirements and technical specifications, ensuring that the design meets high-frequency standards.
3. Circuit design
4. Use professional software for circuit design, optimize signal paths, and reduce interference.
5. PCB layout
6. Implement high-frequency layout and arrange the positions of circuit components reasonably to ensure signal integrity.
7. Production and manufacturing
8. Adopt iron-core furnace welding process for PCB production to ensure welding quality.
9. Testing and verification
10. Conduct rigorous electrical performance testing and environmental adaptability testing on finished products to ensure compliance with design requirements.
summary
High-frequency PCB circuit boards for iron-core inductors are key components for achieving high-frequency signal transmission. Due to their superior performance and broad application prospects, they have become an indispensable part of modern electronic devices. We are committed to providing our customers with high-quality products and professional technical support to meet the evolving needs of the high-frequency market.
The 10-layer high-frequency communication board is a multilayer printed circuit board (PCB) specifically designed for high-frequency communication applications, typically utilizing high-performance materials such as RO4003C, RO4350B, etc. This circuit board boasts superior electrical performance, low loss, and excellent thermal stability, making it widely used in wireless communication, satellite communication, radar, and other high-frequency electronic devices.
Product Features
1. High-frequency performance
2. Low dielectric constant (Dk) and low dielectric loss (Df) ensure effective transmission of high-frequency signals. They provide excellent signal integrity and are suitable for high-speed data transmission.
3. Multi-layer structure
The 4.10-layer design provides ample routing space, supports complex circuit design, and facilitates the separation of multiple signal layers. It is suitable for high-density interconnect (HDI) design and meets the demands of modern electronic products.
5. Excellent thermal management
6. High thermal conductivity materials can effectively dissipate heat, adapting to high-power and high-frequency applications. This enhances the reliability and stability of circuit boards.
7. Mechanical strength
8. It possesses excellent mechanical strength and durability, making it suitable for intricate circuit layouts and diverse environments.
9. Good processability
10. Easy to process and manufacture, suitable for large-scale production and quick delivery.
Application field
Wireless communication: such as base stations, mobile communication devices, etc.
Satellite communication: stable transmission of high-frequency signals.
Radar system: high-precision signal processing and transmission.
IoT devices: Support high-frequency data transmission and connection.
Technical Specifications
Number of layers: 10 layers
Sheet thickness: 1.6MM
Material: Rogers
Solder mask color: green oil with white characters
Process: Immersion gold plating
Minimum drilling: 0.1mm
Minimum line width: 0.3mm
Minimum line spacing: 0.3mm
Conclusion
The 10-layer high-frequency board for communication is an ideal choice in the field of high-frequency communication. With its excellent electrical performance, thermal stability, and multi-layer design, it can meet the stringent requirements of modern communication equipment for high-performance circuit boards. Whether in wireless communication, satellite communication, or other high-frequency applications, this high-frequency board can provide a reliable solution.
Frequently Asked Questions
1.How many staffs do you have in your factory?
Answer: Over 500 people
2. Are the materials used environmentally friendly?
Answer: The materials used comply with ROHS and IPC-4101 standards
3. What is the typical delivery time for high-frequency boards?
Answer: We have raw materials in stock (such as RO4350B, RO4003C, etc.), and our fastest delivery time can be 3-5 days.
4. Impedance mismatch issue of high-frequency board?
Answer: A mismatch between the impedance of the transmission line on the PCB and the output impedance of the signal source or driver may lead to signal reflection, crosstalk, and signal integrity issues.
5. Is there a coating layer between the copper foil and the dielectric of RO3003 material and RO3003G2 material?
Answer: For Rogers' RO3003 and RO3003G2 materials, there is no coating layer between the copper foil and the dielectric layer. The dielectric layer and copper foil are directly laminated at high temperature. This can be observed in the cross-section.
6. Does chemical debinding work on PTFE plates?
Answer: PTFE resin is highly inert, and chemical degreasing solutions have no effect on it. However, for plates made of PTFE resin mixed with a large amount of ceramic fillers, chemical degreasing solutions will attack the ceramic fillers, thereby affecting the electrical properties of the plate. Therefore, it is not recommended to use chemical degreasing for PTFE plates with this structure.
7. Can PTFE sheets be used as bonding sheets and laminated together with FR4 core boards?
Answer: PTFE is a thermoplastic resin that can be used as an adhesive sheet for laminating multi-layer boards. However, its lamination temperature requires 350 degrees Celsius or higher, which most FR4 boards cannot withstand. Therefore, PTFE cannot be used as an adhesive sheet for lamination with FR4 core boards.
