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Product Overview
The 8-layer high-speed server signal transmission PCB is designed specifically for high-speed transmission of server signals. This product uses high-performance FR-4 substrate and a thickness of 3.0mm to ensure the mechanical strength and stability of the PCB. The solder mask design with green and white lettering, as well as the surface treatment of immersion gold and thick gold plating, further enhance the reliability and corrosion resistance of the product, making it suitable for high-frequency and high-density signal transmission environments.
Product Features
1. High speed signal transmission: 8-layer design ensures high-speed signal transmission and low latency, suitable for high-performance servers and data centers.
2. High reliability: FR-4 substrate and surface treatment with gold deposition and plating ensure the stability and reliability of PCB in various environments.
3. Good electrical performance: The 1oz thick inner and outer copper layers ensure low resistance and high current carrying capacity, suitable for high-power and high-frequency signal transmission.
4. Excellent mechanical strength: The thickness of 3.0mm and the green and white solder mask design enhance the mechanical strength and corrosion resistance of the board.
5. Environmental sustainability: Adopting environmentally friendly materials and processes that comply with international environmental standards.
Technical specifications and parameters
number of layers | 8 |
substrate | FR-4 |
thickness | 3.0mm |
color | Solder mask with green oil and white letters |
Sinking gold, plating thick gold | Inner and outer copper thickness |
Inner and outer copper thickness | 1oz/1oz |
size | 161.80mm * 157.05mm |
Minimum line width/line spacing | 0.1mm/0.1mm |
Is there a solder mask present | have |
Application field
High performance server: A high-performance server suitable for data centers, ensuring high-speed signal transmission and low latency.
Network communication equipment: suitable for network communication devices such as routers and switches, providing high-density and high-speed signal transmission.
Storage devices: Suitable for storage arrays and high-performance storage devices, ensuring fast read, write, and transfer of data.
Industrial Automation: Suitable for industrial automation control systems, providing high reliability and stability signal transmission.
Special production process
1. Multilayer lamination technology: Advanced multi-layer lamination technology is adopted to ensure high-density wiring and signal integrity of the 8-layer board.
2. Surface treatment with immersion gold and thick gold plating: Provides low contact resistance and good soldering performance, protects the PCB surface from oxidation and corrosion, and ensures soldering quality.
3. Green solder mask and white silkscreen: enhances the mechanical strength and corrosion resistance of the board, improves product reliability and aesthetics.
4. High precision etching process: Ensure a minimum line width/spacing of 0.1mm/0.1mm to meet high-density wiring requirements and improve circuit integration.
Product Summary
The 8-layer high-speed server signal transmission PCB is a high-performance and highly reliable PCB board designed specifically for high-speed transmission of server signals. Its high-speed signal transmission capability, high reliability, good electrical performance, and excellent mechanical strength make it widely applicable in high-performance servers, network communication equipment, storage devices, and industrial automation. Adopting advanced multi-layer lamination technology and surface treatment with gold deposition and plating to ensure high performance and reliability of the product, it is an ideal choice for modern high-performance computing and communication equipment.
