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The 10-layer high-frequency communication board is a multilayer printed circuit board (PCB) specifically designed for high-frequency communication applications, typically utilizing high-performance materials such as RO4003C, RO4350B, etc. This circuit board boasts superior electrical performance, low loss, and excellent thermal stability, making it widely used in wireless communication, satellite communication, radar, and other high-frequency electronic devices.
Product Features
1. High-frequency performance
2. Low dielectric constant (Dk) and low dielectric loss (Df) ensure effective transmission of high-frequency signals. They provide excellent signal integrity and are suitable for high-speed data transmission.
3. Multi-layer structure
The 4.10-layer design provides ample routing space, supports complex circuit design, and facilitates the separation of multiple signal layers. It is suitable for high-density interconnect (HDI) design and meets the demands of modern electronic products.
5. Excellent thermal management
6. High thermal conductivity materials can effectively dissipate heat, adapting to high-power and high-frequency applications. This enhances the reliability and stability of circuit boards.
7. Mechanical strength
8. It possesses excellent mechanical strength and durability, making it suitable for intricate circuit layouts and diverse environments.
9. Good processability
10. Easy to process and manufacture, suitable for large-scale production and quick delivery.
Application field
Wireless communication: such as base stations, mobile communication devices, etc.
Satellite communication: stable transmission of high-frequency signals.
Radar system: high-precision signal processing and transmission.
IoT devices: Support high-frequency data transmission and connection.
Technical Specifications
Number of layers: 10 layers
Sheet thickness: 1.6MM
Material: Rogers
Solder mask color: green oil with white characters
Process: Immersion gold plating
Minimum drilling: 0.1mm
Minimum line width: 0.3mm
Minimum line spacing: 0.3mm
Conclusion
The 10-layer high-frequency board for communication is an ideal choice in the field of high-frequency communication. With its excellent electrical performance, thermal stability, and multi-layer design, it can meet the stringent requirements of modern communication equipment for high-performance circuit boards. Whether in wireless communication, satellite communication, or other high-frequency applications, this high-frequency board can provide a reliable solution.
Frequently Asked Questions
1.How many staffs do you have in your factory?
Answer: Over 500 people
2. Are the materials used environmentally friendly?
Answer: The materials used comply with ROHS and IPC-4101 standards
3. What is the typical delivery time for high-frequency boards?
Answer: We have raw materials in stock (such as RO4350B, RO4003C, etc.), and our fastest delivery time can be 3-5 days.
4. Impedance mismatch issue of high-frequency board?
Answer: A mismatch between the impedance of the transmission line on the PCB and the output impedance of the signal source or driver may lead to signal reflection, crosstalk, and signal integrity issues.
5. Is there a coating layer between the copper foil and the dielectric of RO3003 material and RO3003G2 material?
Answer: For Rogers' RO3003 and RO3003G2 materials, there is no coating layer between the copper foil and the dielectric layer. The dielectric layer and copper foil are directly laminated at high temperature. This can be observed in the cross-section.
6. Does chemical debinding work on PTFE plates?
Answer: PTFE resin is highly inert, and chemical degreasing solutions have no effect on it. However, for plates made of PTFE resin mixed with a large amount of ceramic fillers, chemical degreasing solutions will attack the ceramic fillers, thereby affecting the electrical properties of the plate. Therefore, it is not recommended to use chemical degreasing for PTFE plates with this structure.
7. Can PTFE sheets be used as bonding sheets and laminated together with FR4 core boards?
Answer: PTFE is a thermoplastic resin that can be used as an adhesive sheet for laminating multi-layer boards. However, its lamination temperature requires 350 degrees Celsius or higher, which most FR4 boards cannot withstand. Therefore, PTFE cannot be used as an adhesive sheet for lamination with FR4 core boards.
