Rogers High Frequency Board PCB

Product Overview

Product Features

1. Excellent Dielectric Properties:Rogers materials have low dielectric constant (Dk) and low dissipation factor (Df), ensuring efficient and stable signal transmission, ideal for high-frequency applications.
2. Good Thermal Stability:The circuit board maintains excellent electrical performance in high-temperature environments, suitable for high-power and high-temperature working conditions.
3. Multi-layer Structure Design:The 6-layer design provides greater design flexibility, supports complex circuit layouts and signal integrity, and meets various application requirements.
4. Hybrid Lamination Technology:Combining the advantages of different materials, hybrid lamination ensures signal quality while reducing production costs and improving efficiency.
5. Chemical Resistance:Rogers materials offer outstanding chemical corrosion resistance, suitable for use in harsh environments.
6. Lightweight Design:Compared with traditional materials, the lightweight characteristic of Rogers materials helps reduce overall equipment weight and improve portability.

Technical Specifications

• Layers: 6 layers

• Materials: Rogers + FR‑4, S1000

• Thickness: 2.0 mm

• Copper Thickness: Inner 0.5 oz / Outer 1 oz

• Solder Mask Color: Green solder mask with white text

• Minimum Line Width / Line Spacing: 0.1 mm / 0.1 mm

• Solder Mask: Yes

• Surface Treatment: Immersion Gold (ENIG)

Application Fields

• Communication Equipment: Base stations, antennas, RF modules, etc.

• Aerospace: Electronic equipment for aircraft and satellites.

• Radar Systems: Military and civilian radar systems.

• Medical Equipment: Imaging equipment, monitoring equipment, etc.

• Automotive Electronics: Automotive electronic systems for high-frequency signal transmission.

Production Process

• Precision Etching: Ensures accuracy of circuit patterns and meets high-density interconnect (HDI) requirements.

• Multi-layer Lamination: Bonds different material layers via high-temperature and high-pressure processes to guarantee electrical performance and mechanical strength.

• Surface Treatment: Various surface treatments such as HASL, ENIG, etc., can be provided according to customer requirements to ensure soldering reliability.

Conclusion

FQA:

1. Q: How many employees do you have in your factory?

A: More than 500.

2. Q: Are the materials you use environmentally friendly?

A: The materials we use are in accordance with ROHS standard and IPC-4101 standard.

3. Q: How long does it generally take to deliver HDI high-frequency PCBs?

A: We have raw material inventory (such as RO4350B, RO4003C, etc.), and our fastest delivery time can be 3-5 days.

4. Q: What problems can impedance mismatch in HDI high-frequency PCBs cause?

A: The impedance of transmission lines on the PCB not matching the output impedance of the signal source or driver can lead to signal reflection, crosstalk, and signal integrity issues.

5. Q: Is there a coating layer between the copper foil and dielectric in RO3003 and RO3003G2 materials?

A: Rogers Corporation's RO3003 and RO3003G2 materials do not have a coating layer between the copper foil and dielectric. The dielectric layer and copper foil are directly laminated at high temperatures, which can be observed in cross-sections.

6. Q: Does chemical de-fluxing work on PTFE materials?

A: PTFE resin is highly inert, and chemical de-fluxing solutions have no effect on PTFE resin. However, for PTFE resin boards mixed with a large amount of ceramic fillers, chemical de-fluxing solutions can attack the ceramic fillers, thereby affecting the electrical properties of the board. Therefore, chemical de-fluxing is not recommended for PTFE boards with this structure.

7. Q: Can PTFE material be used as a bonding sheet and laminated with FR4 core board?

A: PTFE is a thermoplastic resin and can be used as a bonding sheet for laminating multilayer boards. However, its lamination temperature requires 350 degrees or higher, which most FR4 boards cannot withstand, so PTFE cannot be used as a bonding sheet to laminate with FR4 core boards.