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Product Overview
The 6-layer Rogers high-frequency hybrid laminated circuit board is a circuit board specifically designed for high-frequency and high-speed applications. It utilizes Rogers materials as the substrate and combines the advantages of other materials, providing excellent electrical and mechanical properties. This type of circuit board is widely used in fields such as communications, radar, aerospace, and medical equipment.
Product Features
1. Excellent dielectric properties:
Rogers materials feature low dielectric constant (Dk) and low dielectric loss (Df), ensuring efficient and stable signal transmission, making them suitable for high-frequency applications.
2. Good thermal stability:
This circuit board maintains excellent electrical performance even in high-temperature environments, making it suitable for high-power and high-temperature working conditions.
3. Multi-layer structure design:
The 6-layer design offers enhanced design flexibility, supports intricate circuit layouts and signal integrity, and is well-suited for a wide range of application needs.
4. Hybrid pressing technology:
By combining the advantages of different materials, the hybrid pressing technology can reduce production costs and improve production efficiency while ensuring signal quality.
5. Chemical resistance:
Rogers material exhibits excellent chemical resistance and is suitable for use in harsh environments.
6. Lightweight design:
Compared to traditional materials, the lightweight nature of Rogers' materials helps reduce the overall weight of equipment, enhancing portability.
Technical Specifications
Number of layers: 6 layers
Materials: Rogers + FR-4, S1000
Thickness: 2.0mm
Copper thickness: Inner layer 0.5, outer layer 1 oz
Ink color: green ink with white characters
Minimum line width/line spacing: 0.1mm / 0.1mm
Is there solder mask: Yes
Surface treatment: immersion gold plating
Application field
Communication equipment: such as base stations, antennas, radio frequency modules, etc.
Aviation and aerospace: electronic equipment used in aircraft and satellites.
Radar system: Applicable to both military and civilian radar systems.
Medical equipment: such as imaging equipment, monitoring equipment, etc.
Automotive electronics: automotive electronic systems for high-frequency signal transmission.
production process
Precision etching: ensuring the accuracy of circuit patterns to meet the requirements of high-density interconnect (HDI).
Multi-layer stacking: By utilizing high-temperature and high-pressure processes, different layers of materials are combined to ensure both electrical performance and mechanical strength.
Surface treatment: Different surface treatment methods, such as HASL and ENIG, can be provided according to customer needs to ensure soldering reliability.
Conclusion
The 6-layer Rogers high-frequency hybrid laminated circuit board has become an indispensable and crucial component in modern electronic devices due to its excellent performance and broad application prospects. It exhibits significant advantages in signal transmission, thermal management, and durability, making it an ideal choice for high-end electronic product design.
FQA:
1.Q: How many employees do you have in your factory?
A: More than 500.
2.Q: Are the materials you use environmentally friendly?
A: The materials we use are in accordance with ROHS standard and IPC-4101 standard.
3. Q: How long does it generally take to deliver HDI high-frequency PCBs?
A: We have raw material inventory (such as RO4350B, RO4003C, etc.), and our fastest delivery time can be 3-5 days.
4.Q: What problems can impedance mismatch in HDI high-frequency PCBs cause?
A: The impedance of transmission lines on the PCB not matching the output impedance of the signal source or driver can lead to signal reflection, crosstalk, and signal integrity issues.
5.Q: Is there a coating layer between the copper foil and dielectric in RO3003 and RO3003G2 materials?
A: Rogers Corporation's RO3003 and RO3003G2 materials do not have a coating layer between the copper foil and dielectric. The dielectric layer and copper foil are directly laminated at high temperatures, which can be observed in cross-sections.
6.Q: Does chemical de-fluxing work on PTFE materials?
A: PTFE resin is highly inert, and chemical de-fluxing solutions have no effect on PTFE resin. However, for PTFE resin boards mixed with a large amount of ceramic fillers, chemical de-fluxing solutions can attack the ceramic fillers, thereby affecting the electrical properties of the board. Therefore, chemical de-fluxing is not recommended for PTFE boards with this structure.
7.Q: Can PTFE material be used as a bonding sheet and laminated with FR4 core board?
A: PTFE is a thermoplastic resin and can be used as a bonding sheet for laminating multilayer boards. However, its lamination temperature requires 350 degrees or higher, which most FR4 boards cannot withstand, so PTFE cannot be used as a bonding sheet to laminate with FR4 core boards.
