10-layer 5G communication PCB

Product Overview

Product Features

1. High-Frequency Performance:Uses materials with low dielectric constant (Dk) and low dielectric loss (Df), ensuring stable and complete signal transmission under high-frequency conditions to meet the high standards of 5G communication.
2. Multi-Layer Design:The 10-layer structure provides higher wiring density and more complex circuit design capability, supporting effective management and processing of high-speed signals.
3. Excellent Heat Dissipation Performance:Thermal management is considered in the design to ensure thermal stability under high-power operation and extend the service life of equipment.
4. High Reliability:Adopts strict production processes and quality control to ensure product reliability in harsh environments and adapt to various application scenarios.
5. Strong Anti-Interference Capability:Adopts excellent electromagnetic shielding design to reduce the impact of external interference on signals and improve communication quality.
6. Lightweight & Compact Design:The design focuses on light weight and compactness, facilitating integration into various communication equipment and improving the portability and installation flexibility of the whole equipment.

Technical Specifications

• Layers: 10 layers

• Materials: FR-4, SY1000-2

• Thickness: 2.0 mm

• Copper Thickness: Inner 0.1 oz / Outer 1 oz

• Solder Mask Color: Green solder mask with white text

• Minimum Line Width / Line Spacing: 0.075 mm / 0.075 mm

• Solder Mask: Yes

• Surface Treatment: Immersion Gold + Electroplated Thick Gold 30 μ"

Application Fields

• Base Station Equipment: Supports RF modules, signal processing units, etc. of 5G base stations.

• Antenna Systems: Used for high-frequency signal transmission and reception of 5G antennas.

• Network Equipment: Such as routers, switches, etc., supporting high-speed data transmission.

• IoT Devices: Provides a stable communication foundation for various 5G Internet of Things applications.

Production Process

• Precision Etching & Laser Drilling: Ensures the accuracy of circuit patterns and meets the requirements of high-density interconnect (HDI).

• Multi-Layer Lamination Technology: Bonds materials of different layers through high-temperature and high-pressure processes to ensure electrical performance and mechanical strength.

• Surface Treatment: Provides a variety of surface treatment options, such as metallization (ENIG, HASL, etc.), to improve soldering reliability and corrosion resistance.

Conclusion

With its excellent performance, reliability and broad application prospects, the 10-layer 5G communication circuit board for Huawei has become an indispensable and important part of 5G communication equipment. It shows significant advantages in signal transmission, thermal management and anti-interference capability, promoting the wide application and development of 5G technology.

FQA:

1.Q: How far is your factory from the nearest airport?

A: About 30 kilometers

2.Q: What is your minimum order quantity?

A: One piece is enough to place an order.

3.Q: When can I get a quotation after I provide Gerber, product process requirements?

A: Our sales staff will give you a quotation within 1 hour.

4.Q: How to solve the common overheating problems when using communication PCB boards?

A: The key is to introduce heat dissipation design and or choose high quality materials. For example: EMC, TUC, Rogers and other companies to provide the board.

5.Q: How to avoid high-frequency and high-speed PCB circuit board common signal interference?

A: The need to optimize the PCB layout and reasonable planning of the ground to reduce the impact of interference.

6.Q: Do you have laser drilling machines?

A: We have the most advanced laser drilling machine in the world.

7.Q: Can your company manufacture impedance boards and crimp hole circuit boards?

A: We can produce impedance PCBs, and the same product can be made with multiple impedance values. We can also manufacture precision holes for crimp holes.