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Product Overview
The "14 layers communication receiving AC PCB" is a high-performance printed circuit board designed specifically for signal receiving terminals in communication systems. It adopts advanced multi-layer design and high-end materials, which can meet the needs of complex signal processing and high-frequency transmission, and is widely used in modern communication equipment.
Product Features
High density wiring: With a 14 layers structural design, the wiring density is greatly increased, enabling complex circuit connections to be achieved in a limited space.
Excellent signal integrity: The substrate DS7409HGB with low dielectric loss is used to ensure the stability and low latency of high-frequency signal transmission.
High reliability: The surface treatment process of 1U immersion gold provides good weldability and oxidation resistance, extending the product's service life.
Fine processing capability: The line width/spacing can reach 0.05mm/0.05mm, and the minimum aperture is only 15 μ m, meeting the requirements of high-precision circuit design.
Good heat dissipation performance: Multilayer design helps to dissipate heat and ensure stable operation of the equipment at high frequencies.
Technical Specifications
number of layers | 14 |
substrate | DS7409HGB |
thickness | 1.0mm |
ink color | Green and white letters |
Minimum line width/line spacing | 0.05mm/0.05mm |
Is there a solder mask present | have |
Surface treatment method | Sinking Gold 1U |
Application Areas
Communication base station: used for signal reception and processing modules to ensure efficient communication between the base station and terminal devices.
Satellite communication equipment: suitable for satellite antennas and signal processing units, ensuring long-distance signal transmission.
Wireless router: Used in home and enterprise networks to receive and forward wireless signals.
5G devices: support high-frequency signal transmission over 5G networks to meet high-speed data communication needs.
The special production process adopted
1. High precision drilling technology: Achieve a minimum aperture of 15 μ m to ensure precise connections between multiple layers.
2. Fine line etching process: Ensure a line width/spacing of 0.05mm/0.05mm to meet high-density wiring requirements.
3. Gold immersion surface treatment: Provides excellent weldability and oxidation resistance, suitable for high-frequency signal transmission.
Product Summary
The "14 layers communication receiving AC PCB" has become an indispensable core component in communication systems due to its high density, high reliability, and excellent signal integrity. It not only meets the needs of modern communication equipment for high-frequency signal transmission, but also ensures the high performance and long life of the product through fine processing technology and high-end materials.